ISO INTERNATIONAL STANDARD 21859 First edition 2019-06-26 Fine ceramics (advanced ceramics, advanced technical ceramics) Test method for plasma resistance of ceramic components in semiconductor manufacturing equipment Céramiques techniques-Méthode d'essaipourdéterminer laresistanceauplasmadescomposantsceramiquesdansles équipementsdeproductionasemi-conducteurs Referencenumber IS0 21859:2019(E) ISO @IS02019 @ IS0 2019, Published in Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form written permission. Permission can be requested from either Iso at the address below or Iso's member body in the country of the requester. ISO copyright office Ch.deBlandonnet8 ·CP401 CH-1214 Vernier,Geneva, Switzerland Tel. +41 22 749 01 11 Fax +41 22 749 09 47 copyright@iso.org www.iso.org ii ISO 2019-Allrights reserved Contents Page Foreword iv 1 Scope 2 Normative references .1 3 Terms and definitions. .1 4 Principle ofmeasurement .1 5 Test environment .2 6 Apparatus. .2 Plasma-etching equipment. 2 6.1 6.2 Contact-probe profilometer. 2 6.3 Surfaceroughnessprofilometer 2 7 Test pieces 2 7.1 General consideration 2 7.2 Surface conditions 2 Procedure. 8 2 8.1 Measurement of surface roughness before a plasma resistance test 2 8.2 Masking 3 3 8.3 Plasma resistance test 8.3.1 Settingoftestpieces 3 8.3.2 Test conditions. 3 8.4 Measurement oferosion depth 3 8.5 Measurementof surfaceroughness after theplasmaresistancetest 3 9 Calculation 3 9.1 Calculationofmeanerosiondepth 3 9.2 Calculationofsurfaceroughness. 4 10 Test report. 4 @ IS0 2019 - All rights reserved iii